IEEE DataCom 2017
The 3rd IEEE International Conference on Big Data Intelligence and Computing
Orlando, Florida, USA, November 6-10, 2017
Sponsors
Co-Organizer
Organization

General Chairs

Sanjay Ranka
University of Florida, USA
Hai Jin
HUST, China
Manu Malek
Stevens Inst. of Tech., USA

General Executive Chairs

Jun Wang
University of Central Florida, USA
Tao Li
NSF/UFL, USA

Program Chairs

Anna Kobusinska
Poznan University of Technology, Poland
Xiaolin Li
University of Florida, USA
Wenguang Chen
Tsinghua University, China

Workshop Chairs

I-Hsin Chung
IBM Thomas J. Watson Research Center, USA
Wuu Yang
National Chiao Tung University, Taiwan

Demo/Poster Chair

Che-Rung Lee
Tsing Hua University, Taiwan

Special Session Chair

Hai Jiang
Arkansas State University, USA

Award Chair

Weisong Shi
Wayne State University, USA

International Liaison & Publicity Chair

Bingsheng He
Nanyang Technological University, Singapore
Jun Huang
Chongqing University of Posts and Telecommunications, China
Bahman Javadi
Western Sydney University, Australia
William Liu
Auckland University of Technology, New Zealand
Bhekisipho Twala
Univ. Johannesburg, South Africa
Hao Wang
Norwegian University of Science and Technology, Norway
Sheng-De Wang
National Taiwan University, Taiwan

Publication Chair

Hui-Huang Hsu
Tamkang University, Taiwan

Advisory Committee

Christophe CĂ©rin
University of Paris XIII, France
Yeh-Ching Chung
National Tsing Hua University, Taiwan
Jie Li
University of Tsukuba, Japan
Beniamino Di Martino
Second University of Naples, Italy
Domenico Talia
UniversitĂ  della Calabria, Italy
Vincent S. Tseng
National Chiao Tung Univ. Taiwan
Cho-Li Wang
The Univ. of Hong Kong, Hong Kong
Jinsong Wu
University de Chile, Chile
Jinjun Chen
Swinburne University of Technology, Australia

Steering Committee

Robert Hsu
Chung Hua University, Taiwan
Geoffrey Fox
Indiana University, USA
Yuanyuan Yang
Stony Brook University, USA